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Product Overview
Good thermostability Waterproof and resistant to ageing Good resistance to PVC softeners Slightly tacky Notice Polyamides in balance with air humidity. The moisture absorbed can cause foaming (vapour formation) when melting polyamides. We recommend resealing the packaging well after each removal, and if necessary to dry the hot melt adhesive for 48 hours at approx. 50C prior to processing. Heat occurring during storage (e.g. due to solar radiation) must be avoided due to the changes to the outer shape of the hot melt adhesive this can cause. The usage instructions are recommendations based on the tests we have conducted and on our experience, carry out your own tests before each application. Due to the large number of applications and storage and processing conditions, we do not assume any liability for a specific application result. Insofar as our free customer service provides technical information or acts as an advisory service, no responsibility is assumed by this service except where the advice or information given falls within the scope of our specified, contractually agreed service or the advisor was acting with deliberate intent. We guarantee the consistent quality of our products. We reserve the right to make technical changes and further develop products. Please observe the technical data sheet!
Features
Hot melt adhesive 101 Elastic hot melt adhesive for dent removal, and for securing components and coil wires in the electrical industry. Weight of content: 200 g Chemical basis: Polyamide Colour: Yellow Length: 200 mm Diameter: 12 mm Density/conditions: 1 g/cm / at 20C Viscosity: 3500 mPas Softening point: 140 C Min./max. open time: 20-60 s Min./max. processing temperature: 180 to 210 C Shelf life from production: 18 Month Silicone-free: Yes Solvent-free: Yes Number of pieces: 10 PCS show more ... show less ...
Technical Specifications
Good thermostability Waterproof and resistant to ageing Good resistance to PVC softeners Slightly tacky Notice Polyamides in balance with air humidity. The moisture absorbed can cause foaming (vapour formation) when melting polyamides. We recommend resealing the packaging well after each removal, and if necessary to dry the hot melt adhesive for 48 hours at approx. 50C prior to processing. Heat occurring during storage (e.g. due to solar radiation) must be avoided due to the changes to the outer shape of the hot melt adhesive this can cause. The usage instructions are recommendations based on the tests we have conducted and on our experience, carry out your own tests before each application. Due to the large number of applications and storage and processing conditions, we do not assume any liability for a specific application result. Insofar as our free customer service provides technical information or acts as an advisory service, no responsibility is assumed by this service except where the advice or information given falls within the scope of our specified, contractually agreed service or the advisor was acting with deliberate intent. We guarantee the consistent quality of our products. We reserve the right to make technical changes and further develop products. Please observe the technical data sheet!